|
|
Project |
Capability |
|
1 |
Layers |
2－16 layers |
|
2 |
Board thickness |
0.40mm--3.20mm (16--126mil) |
|
3 |
Min trace width/space |
0.075mm/0.075mm |
|
(Base copper thickness: Hoz)(3mil/3mil) |
||
|
4 |
Base copper thickness |
Inner layers (Hoz—6oz)(UL approval ) |
|
Outer layers (Hoz—6oz)(UL approval ) |
||
|
5 |
Min hole diameter |
0.15mm(6mil) |
|
6 |
Min Copper thickness in hole |
20~70um |
|
7 |
PTH size tolerance |
±0.08mm-±0.05mm(±3mil-±2mil) |
|
8 |
NPTH size tolerance |
±0.05mm-±0.025mm(±2mil-±1mil) |
|
9 |
Hole position tolerance |
±0.05mm(2mil) |
|
10 |
Dimension tolerance |
±0.1mm(4mil) |
|
11 |
Min solder mask dam |
0.08mm(3mil) |
|
13 |
Aspect ratio |
10 : 1 |
|
14 |
Board twist and wrap |
≤0.75% |
|
15 |
Plug hole diameter |
0.20—0.60mm(8mil—24mil) |
|
16 |
Impedance control |
±10% |
|
17 |
Surface finish |
LF-HSAL(SnNiCu&SnAgCu), OSP, HASL, Immersion Gold (finished inside) |
|
Immersion Tin, Immersion Ag (finished by subcontractor) |
